Effect of Grain Size and Texture of Polycrystalline Tungsten on Ion-Beam Sputtering

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Abstract

The effect of grain size and texture of polycrystalline tungsten on the sputtering yield and surface morphology under high-dose irradiation with 30 keV Ar+ ions has been studied. Samples with an average grain size from 300 nm to 7 μm, without texture and with a [001] texture have been used in the experiment. It is shown that the ion-induced surface morphology strongly depends on the grain size and irradiation fluence. The grain size has little (less than 10%) effect on the sputtering yield, while the texture can reduce the sputtering yield by a factor of two. An experiment with varying the angle has shown that the channeling effect is the reason for the two-fold decrease in the sputtering yield for textured samples. The influence of the surface relief on the sputtering yield has been analyzed. An expression taking into account atomic redeposition and ion reflection is proposed to predict the sputtering yield of a surface with ion-induced relief.

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About the authors

R. Kh. Khisamov

Institute for Metals Superplasticity Problems of the Russian Academy of Sciences

Author for correspondence.
Email: r.khisamov@mail.ru
Russian Federation, Ufa

N. N. Andrianova

Lomonosov Moscow State University; Moscow Aviation Institute

Email: r.khisamov@mail.ru
Russian Federation, Moscow; Moscow

A. M. Borisov

Institute for Metals Superplasticity Problems of the Russian Academy of Sciences; Lomonosov Moscow State University; Moscow Aviation Institute

Email: r.khisamov@mail.ru
Russian Federation, Ufa; Moscow; Moscow

M. A. Ovchinnikov

Lomonosov Moscow State University

Email: r.khisamov@mail.ru
Russian Federation, Moscow

R. R. Mulyukov

Institute for Metals Superplasticity Problems of the Russian Academy of Sciences

Email: r.khisamov@mail.ru
Russian Federation, Ufa

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2. Fig. 1. SEM images obtained in the reflected electron diffraction mode of fine-grained (sheet) (a, b) and ultrafine-grained (high-pressure torsion) (c, d) tungsten samples of initial (a, c) and after annealing at 1400 (b) and 1500°C (d).

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7. Fig. 2. SEM images of the surface of fine-grained (sheet) (a, b) and ultrafine-grained (high-pressure torsion) (c, d) tungsten samples of initial (a, c) and after annealing at 1400 (b) and 1500°C (d), after irradiation with Ar+ ions with energy 30 keV, fluence 9 × 1018 cm-2. The imaging angle is 45°.

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8. Fig. 3. Dependences of mass change Δm on irradiation fluence F (a) and sputtering coefficient Y on sputtering layer thickness Δx (b) of fine (sheet) (1, 2) and ultrafine (high-pressure torsion) (3, 4) tungsten samples of initial (1, 3) and after annealing at 140 (2) and 1500°C (4), after irradiation with Ar+ ions with 30 keV energy. Normal ion drop, target temperature not higher than 50°C.

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9. Fig. 4. Tilt angles of cones on the surface of ultrafine-grained (high-pressure torsion) (a) and fine-grained (sheet) tungsten (b), as well as characteristic SEM images of these samples after annealing at 140 and 1500°C (c) (imaging angle 45°), respectively, under irradiation with 30 keV Ar+ ions. Distribution of slope angles θ for initial ultrafine-grained (high-pressure torsion) (1) and annealed at 1500°C (2) tungsten samples (d). The inset shows a schematic representation of the cone.

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10. Fig. 5. Dependence of the Y coefficient on the inclination angle θ for a single cone Y (θ) (1) and cone-shaped relief Үk (θ) (2) on the tungsten surface when trained by Ar+ ions with 30 keV energy at normal ion incidence.

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11. Fig. 6. Sputtering coefficient Y as a function of tilt angle for a fine-grained (sheet) tungsten sample with [001] grain texture when trained with 30 keV Ar+ ions (1), and an ultrafine-grained (high-pressure torsion) sample (2).

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